| Image | Name | Description & Examples |
 Click to expand | Ball Grid Array aka BGA | BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use. |
| Plastic Quad Flat Package aka PQFP | The Plastic Quad Flat Pack, or PQFP, is an IC package with leads extending from all four sides of the package body. PQFP's are predominantly square in shape, although rectangular variants do exist. The PQFP is just one of the many types of the quad flat pack (QFP) package. |
 | Ceramic Column Grid Array, or CCGA | The Ceramic Column Grid Array, or CCGA, is a square-shaped or rectangular ceramic package that uses solder columns for external electrical connection instead of leads or solder balls. These solder columns are arranged in a grid or array at the bottom of the ceramic package body, hence the name 'ceramic column grid array'. The CCGA is basically just a CBGA package that has solder columns instead of solder balls. |
| PSOP - Power Small Outline Package | The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power. |
| CerDIP - Ceremic Dual In-line Package | The Ceramic Dual In-line Package, or CerDIP is one of the most mature IC packages still in use today. It is a rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. |
| QFN - Quad Flat No Leads | The Quad Flat No Leads package, or QFN, is a very small square-shaped or rectangular surface-mount plastic package with no leads. It is basically a quad flat package, except for the absence of leads protruding from its sides. Metal pads or lands around the periphery of the bottom of the QFN package serve as electrical connection points to the outside world. Because the QFN has no leads and has shorter bond wire lengths, it exhibits less inductance than leaded packages and therefore provides a higher electrical performance. The QFN package also includes an exposed thermal pad at the package bottom to facilitate heat dissipation from the die. |
 | Ceramic Package, or Cerpack | The Ceramic Package, or Cerpack, is a hermetically sealed rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. It is therefore a type of dual-in-line package (DIP) like the CerDIP. |
 | QSOP - Quarter Size Outline Package | The Quarter Size Outline Package, or QSOP, is a small rectangular surface-mount plastic package with gull wing leads protruding out of its longer sides.The QSOP comes in two standard body widths: the narrow body QSOP which has a nominal body thickness of 150 mils and the wide body QSOP which has a nominal body thickness of 300 mils. Typical QSOP lead counts range from 16 to 28 leads for the narrow body and 36 to 44 leads for the wide body. The QSOP lead pitch is typically 25 mils. |
| CLCC or LCC - Ceramic Leadless Chip Carrier | The Ceramic Leadless Chip Carrier, or CLCC or LCC, is a square or rectangular surface-mount ceramic package that has no leads. For electrical connection to the outside world, the LCC instead uses flat metal contacts (or metallized castellations) known as pads around the four sides of the package bottom. |
 | Sidebraze Package | The Sidebraze Package, is one of the most mature IC packages still in use today. It is a rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins. It is therefore a type of dual-in-line package (DIP). Two other widely used DIP's are the PDIP and the CerDIP. |
| CPGA - Ceramic Pin Grid Array | The Ceramic Pin Grid Array, or CPGA, is a square or rectangular through-hole ceramic package whose pins or leads are arranged in a square array at the bottom of the package body. The CPGA can either have a frit-sealed ceramic lid or a solder-sealed metal lid.The CPGA is just one of several types of the PGA package. The PGA is a popular choice for devices with high I/O counts such as microprocessors because of its high pin density. |
| Small Outline Transistor (SOT) Package | Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. Due to their low cost and low profile, SOT's are widely used in consumer electronics. The SOT-23 and the SC-70 packages are two of the most widely used SOT packages today. Note that aside from these two, there are many other SOT package types used in the IC industry. |
 | CQFP - Ceramic Quad Flat Pack | The Ceramic Quad Flat Pack, or CQFP, is a ceramic IC package with leads extending from all four sides of the package body. CQFP's are predominantly square in shape, although rectangular variants do exist. The CQFP is just one of the many types of the quad flat pack (QFP) package. |
 | Single-in-Line Package (SIP) | The Single-in-Line Package, or SIP, is an IC package that has a single row of leads protruding from the bottom of its body. It is not as widely used as dual-in-line packages such as the PDIP and the CerDIP because of its limited number of pins. SIP's are often used in packaging networks of multiple resistors. |
 | D2PAK or DDPAK - Double Decawatt Package | The Double Decawatt Package, or D2PAK or DDPAK is the successor to the DPAK package, which was designed by Motorola to encase discrete high-power devices. The D2PAK is bigger than the DPAK, and comes in several versions with different terminal counts. The D2PAK, which has a flat heat sink at the back, is basically the surface-mount equivalent of the TO-220 through-hole package and is therefore sometimes referred to as 'SMD-220'. The D2PAK is also known as 'TO-263'. |
 | SOIC - Small Outline Integrated Circuit | The 'Small Outline Integrated Circuit', or SOIC, is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. The leads protrude from the longer edge of the package. It is one of the most commonly used surface mount packages today. |
 | D3PAK - Decawatt Package 3 | The Decawatt Package 3, or D3PAK, is a bigger version of the D2PAK package. Just like the D2PAK (and the DPAK, the D2PAK's predecessor), the D3PAK is a surface-mount plastic-molded package intended for high-power discrete devices. The D3PAK is also known by other names such as 'TO-268' and 'Discrete Package 3'. |
 | SOJ: Small Outline J-Lead Package | The 'Small Outline J-Lead Package', or SOJ, is a small rectangular surface-mount plastic-molded integrated circuit package with J-formed leads. The leads protrude from the longer edge of the package. The SOJ is also sometimes referred to as 'SOIJ', or J-leaded small outline IC package. |
 | DFN - Dual Flat No Leads | The Dual Flat No Leads package, or DFN, is a very small square-shaped or rectangular surface-mount plastic package with no leads. Metal pads or lands along two sides of the bottom of the DFN package serve as electrical connection points to the outside world. The DFN is similar to the QFN, except that the latter has lands all around the periphery of the package instead of just two sides like the DFN. |
 | DPAK - Decawatt Package | The Decawatt Package, or DPAK, is an IC package developed by Motorola to encase discrete high-power devices. The DPAK is also known as the 'TO-252'. The acronym 'DPAK' can also stand for the term 'Discrete Package'.DPAKs can have 3 or 5 terminals. |
 | SPDIP - Shrink Plastic Dual-in-Line Package | The Shrink Plastic Dual In-line Package, or SPDIP, is a rectangular plastic package with leads extending from both of its long sides, thus forming two sets of in-line pins. The SPDIP is actually just a 'shrink' version of the PDIP. As such, the SPDIP provides a smaller package size compared to a standard PDIP for the same lead count. |
| FBGA - Fine-Pitch Ball Grid Array | The Fine Pitch Ball Grid Array, or FPBGA or FBGA, is a smaller version of the ball grid array (BGA) package. As in all BGA packages, FBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. However, the FBGA is near-chip-scale in size, with a smaller and thinner body than the standard BGA package. As its name implies, it also features a finer ball pitch (smaller distance between balls). |
| SSOP - Shrink Small Outline Package | The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. |
 | JLCC - J-Leaded Ceramic Chip Carrier | The J-Leaded Ceramic Chip Carrier, or JLCC, is a square or rectangular surface-mount ceramic package that has J-formed leads around its periphery. The plastic-molded equivalent of the JLCC is the PLCC. |
 | TDFN - Thin Dual Flat No Leads | The Thin Dual Flat No Leads package, or TDFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads along two sides of the package body for electrical connection to the outside world. It is basically a thinner version of the dual flat no leads (DFN) package. |
 | LFBGA - Low Profile Fine-Pitch Ball Grid Array | The Low-Profile Fine Pitch Ball Grid Array, or LFPBGA, is a smaller version of the ball grid array (BGA) package. It is basically an FBGA package that has a package height ranging from 1.2 mm and 1.7 mm. It is therefore thicker than the TFBGA and the VFBGA. |
 | TFBGA - Thin Profile Fine-Pitch Ball Grid Array | The Thin Profile Fine Pitch Ball Grid Array, or TFBGA, is a thinner version of the FBGA package. Like all BGA packages, TFBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. The TFBGA is near-chip-scale in size and features ball pitch values that are even tighter than those of the FBGA. |
| TQFN - Thin Quad Flat No Leads | The Thin Quad Flat No Leads package, or TQFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads around the periphery of the bottom of the package body for electrical connection to the outside world. It is basically a thinner version of the quad flat no leads (QFN) package. |
 | LGA - Land Grid Array | The Land Grid Array, or LGA, is a package that uses metal pads for external electrical connection instead of leads (as in the pin grid array) or solder balls (as in the ball grid array). These metal pads, which are called 'lands', are arranged in a grid or array at the bottom of the package body, hence the name 'land grid array'. The grid arrangement of the lands of the LGA package allows it to have a high land count, making it a popular packaging option for devices with high I/O requirements. |
 | TQFP - Thin Quad Flat Pack | The Thin Quad Flat Pack, or TQFP, is a surface-mount IC package with gull wing leads on all four sides of the package body. It is basically a thinner version of the MQFP and LQFP. |
 | LQFP - Low Profile Quad Flat Pack | The Low Profile Quad Flat Pack, or LQFP, is a surface-mount IC package with leads extending from all four sides of the package body. |
 | TSOP - Thin Small Outline Package | The Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1.0 mm. There are two types of TSOP's. The Type I TSOP has its leads protruding from the shorter edges of the package. The Type II TSOP has its leads protruding from the longer edges of the package. |
 | MLP - Micro Leadframe Package | The Micro Leadframe Package, or MLP, is a JEDEC-compliant, very thin, near-CSP square-shaped or rectangular surface-mount plastic package uses metal pads instead of leads for electrical connection to the outside world. The MLP belongs to the same 'no leads' package family as the QFN and the DFN. |
 | TSSOP - Thin Shrink Small Outline Package | The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. |
 | MQFP - Metric Quad Flat Pack | The Metric Quad Flat Pack, or MQFP, is a surface-mount IC package with gull wing leads on all four sides of the package body. |
 | UTDFN - Ultra Thin Dual Flat No Leads | The Ultra Thin Dual Flat No Leads package, or UTDFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads along two sides of the package body for electrical connection to the outside world. It is basically a thinner version of the thin dual flat no leads (TDFN) package. |
 | MSOP - Micro Small Outline Package | The Micro Small Outline Package, or micro-SOP or MSOP, is a very small rectangular plastic package with gull wing leads protruding out of its longer sides. The MSOP is a miniaturized version of the SSOP package, having a smaller footprint than the latter. |
 | UTQFN - Ultra Thin Quad Flat No Leads | The Ultra Thin Quad Flat No Leads package, or UTQFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads around the periphery of the package body for electrical connection to the outside world. It is basically a thinner version of the thin quad flat no leads (TQFN) package. |
 | PDIP - Plastic Dual-in-Line Package | he Plastic Dual In-line Package, or PDIP, is one of the most mature plastic IC packages still in use today. It is rectangular in shape and has leads extending from both sides along its length, thus forming two sets of in-line pins. |
| VSOP - Very Small Outline Package | The Very Small Outline Package, or VSOP, is one of several smaller versions of the SOIC package, having a compressed body and a tightened pitch for its gull wing leads. Another smaller version of the SOIC is the SSOP. |
| PLCC - Plastic Leaded Chip Carrier | The Plastic Leaded Chip Carrier, or PLCC is a four-sided plastic package that has “J” leads around its periphery. These “J” leads occupy less board space than the gull-wing leads that other packages like the SOIC have. PLCC lead counts range from 18 to 84. PLCC packages can either be square or rectangular in shape. The ceramic equivalent of the PLCC is the JLCC. |